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source: UCBerkeley Last updated on 2014年12月4日
Electrical Engineering 143, 001 - Fall 2014
Microfabrication Technology - Clark Tu-cuong Nguyen
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Electrical Engineering 143 - 2014-09-11: Process Integration 1:16:19
2014-09-16:Layout to Cross-Section, Design Ru 1:20:39
2014-09-18: Lithography I: Radiation Sources, 1:19:30
2014-09-23: Lithography II: Optics, Resolutio 1:21:54
2014-09-25: Oxidation I: Thermal Oxidation Mo 1:22:34
2014-09-30: Oxidation II: Graphs, Dopant Redi 1:22:24
2014-10-02: Physical Film Deposition: Evapora 1:20:56
2014-10-07: Chemical Film Deposition -- LPCVD 1:22:56
2014-10-09: Etching I -- Anisotropy, Selectiv 1:21:19
2014-10-14: Ion Implantation I -- Etching II: 1:20:29
2014-10-16: Ion Implantation I -- Range & Str 1:19:06
2014-10-21: Ion Implantation II -- I/I Throug 1:21:24
2014-10-23: Diffusion I -- Predeposition, Dri 1:18:10
2014-10-28: Diffusion II: 2-Step Diffusion, S 1:19:27
2014-11-04: Diffusion III: Series Resistance, 1:11:36
2014-11-06: Interconnects: Contacts, Metalliz 1:18:51
2014-11-13: Metal MEMS, Adv. CMOS I: Device S 1:15:18
2014-11-18: Adv. CMOS II: Process Flow (cont. 1:19:25
2014-11-20: Adv. Isolation: Problems w/ LOCOS 1:18:10
2014-11-25: Device Characterization I: MOS-CV 1:20:38
2014-12-02: Vt Implant: Threshold Voltage, Sh 1:20:45
2014-12-04: Device Characterization II: MOS D 1:04:31
